Dispensing Systems Techcon Product Catalogue
Valve Application Guide
Micro Needle (TS5440)
Mini Spool (TS5322)
HP Spool (TS941)
Diaphragm (TS5620) 1 (TS5624DMP) 2
Pinch (TS1212)
Needle (TS5420)
Rotary DMP (TS5000DMP)
Rotary (TS7000)
Spray (TS5540)
Jet (TS9000)
PC Pump (TS8100)
Valve Version
1
2
u
u
u u u
u
8
4
8
4 8 4
Micro shots
4 4 4 4 4 4 4 4 4 8 4 4
Dots
4 4 4 4 4 4 4 4 4 8 4 4
Lines/Beads
u u u
4 4 4 4 4 4 8
8
4
Potting & Encapsulation
u u
4 4 4 4 4 4 4
8
8
4
Packaging/Filling
8 8 8 4 4 8 8
8
8
8
8
8
High Pressure
8 8 8 8 8 8 8
8
8
4 8
8
Sprayed
8 8 8 8 8 8 8
8
8
8 4 8
Jetting
Viscosity High
8 8 8 4 4 8 8
4 4 8 4 4
u
8 8
4 4 8 8
4 4 8 4 4
Medium
u u
4 4 4
4 4 8
8
4 4 4
Low
Application Activators
u u
4 4 4
4 4 8
8
4 4 4
u u
u
4 4 4
4 4 8
8
4
4
Alcohol
u
4 8 8 8 8 4 4 4
8
8
8
Anaerobics
u
8 8 8 8 8 8 8
8
4 8
8
Brazing Paste
u u u u
u u
8
4 4 8
8
4
Conformal Coatings
4 8 8 8 8 4 4 8
8
8
8
8
Cyanoacrylates
u u u u u
u
8
4 4 8 4 4
Epoxies
u u
4 4 4
4 4 8
8
4 4 4
Flux (liquid)
8 8 8 4 4 8 8
4 4 8 4 4
Flux (paste)
u
8 8
4 4 8 8
4 4 8 4 4
Greases
u u
u
4 4 4
4 4 8
8
4
4
Inks
u u
u u
4
4 4 8
8
4 4 4
Lacquers
u u
4 4 4
4 4 8
8
4 8
4
Mold Releases
u u
4 4 4
4 4 8
8
4 4 4
Oils
u u
4 4 4
4 4 8
8
4 4 4
Paints
u
4 4 8 8 4 4 8
8
4 4 4
Reagent
u
8 8 8 4 4 8 8
4 4 8
4
RTVāSilicone
u u
4
4 4 4 4 8
8
8 4 4
Solder masks
u u
u
8 8 8
8 8
4 8
8
4
Solder pastes
4 4 4 8 8 4 4 8
8
4 4 4
Solvents
4 8 8 8 8 8 4 4
8
8
8
8
Two-part adhesive
u
u
8 4
8 4 4 8
8
4 4 4
UV cure/adhesive (liquid)
8 8 4 4 8 8 8
4 4 8 4 4
UV cure/adhesive (gel)
u
4 8 8 8 8 4 4 4
8
8
8
UV cure with anaerobic
Excellent - 4
Do not use - 8
Average - u
Disclaimer: The valve application guide is for reference only. Please contact a Techcon applications engineer for accurate valve recommendation.
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